The 11th edition of the WARSAW PACK Packaging Technology Trade Fair took place from 14 to 16 April in Nadarzyn, near Warsaw. The event brings together all sectors of the packaging technology and packaging industry and provides an ideal setting for establishing business relationships. In addition, the ‘WARSAW PACK’ fair provides an excellent opportunity to discover the latest trends and solutions during conferences, workshops and congresses in the packaging technology and packaging industry.

This year’s edition was a special one for us. The DWM HPX Checkweigher received an award in the category ‘Automation, Robotics and Industry 4.0 in Packaging Processes’. This prestigious accolade confirms that the technologies we develop meet the real needs of modern industry and are in line with the trend towards digital transformation. We would like to express our sincere thanks for this recognition – it is not only a source of pride for us, but also an incentive to continue improving our solutions.

We would also like to thank everyone who visited our stand; thank you for your questions, comments and the time we spent together. If we didn’t manage to speak to you, please do get in touch after the fair.